Process Engineer Backend/Packaging Semiconductor Manufacturing (m/f)
We produce 8” wafers at our facility in Sargans and from these ASICs in the field of optical semiconductors in our own front and backend production. This includes implantation, annealing, PECVD, galvanism, UBM, Dicing, Sorter, testing and packaging amongst other things.
We seek a talented individual for the backend section to assume responsibility for the production processes and facilities. This person monitors the processes, initiates and drives constant optimization of same and specifies and implements new developments. Working closely with Production, R&D and quality management. To assist in performing these duties we provide an excellent infrastructure and the successful candidate will be able to rely on a very competent and collegial environment.
Your responsibilities
- Optimization of existing processes as well as developing and introducing new processes in the area of assembly and connection technology including documentation
- Ensuring successful and continuous operation of the established production processes and tools with regard to throughput, product quality and cost optimization
- Specifying and selecting tools and materials according to the product roadmap in close cooperation with production, R&D and purchasing
- Designing and establishing relevant production lines
- Discovering, analyzing and eliminating any problems that may arise in terms of production, quality, or within your facility
- Supporting product development, -qualification and characterization
- Evaluating und qualification of external suppliers and the appropriate solutions and in the case of outsourcing of processes including implementation of any necessary transfer of technology
- Active promotion of our team philosophy “One company, one team, one spirit!” and our service concept “More than you expect!”
Your skills
- A Master or Bachelor degree in electrics, electronics, microelectronics or equivalent
- Knowledge of chip manufacturing in the field of backend processing
- Knowledge of electronics manufacturing in the field of assembly and connection technology
- Experience in the area of optical packaging would be advantageous
- A communicative and team-oriented approach
- A heightened awareness of quality,and a very service orientated and independent, result-orientated approach to work
- As the company communicates both internally and with customers in both English and German. Fluency in English (both written and oral) is required and fluency in at least oral German would be advantageous
- Skills in Office- applications